Longitudinal Deformation Analysis of High-Resolution Integrated Images Based on Multi-Sensors

Authors

  • Hongjie Chen Information Engineering Department, Yantai Gold College, Zhaoyuan 265401, China
  • Chuan Xiao College of Engineering, Yantai Nanshan University, Yantai 265713, China

Abstract

In order to improve the quality of high-resolution integrated images, a longitudinal deformation analysis method is applied to such images based on multi-sensors. The high-resolution integrated images are collected by CMOS (complementary metal oxide semiconductor) and CCD (charge-coupled device) image sensors, and are then fused using the Laplace shape decomposition method. The fast ICA algorithm is applied to enhance the fused high-resolution integrated images. Based on the processed images, a high-resolution integrated image longitudinal deformation model is constructed, and the model is trained by an implicit support vector machine. The longitudinal deformation analysis results of the high-resolution integrated image are obtained by combining the longitudinal deformation distances. According to experimental results, the proposed method has high analytical
accuracy, good image longitudinal deformation processing, high level of efficiency in terms of longitudinal deformation analysis, and good practical application.

Keywords: Multi-Sensor; High-Resolution Integrated Image; Longitudinal Deformation; Laplace Shape Decomposition Method;
Fast ICA Algorithm; Deformation Distance

Cite As

H. Chen, C. Xiao, "Longitudinal Deformation Analysis of High-Resolution Integrated Images Based on
Multi-Sensors", Engineering Intelligent Systems, vol. 31 no. 1, pp. 33-42, 2022.





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Published

2023-01-01

Issue

Vol. 31 No. 1 (2023): International Journal of Engineering Intelligent Systems

Section

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